DIN EN 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
inactive
| Organization: | DIN |
| Publication Date: | 1 June 2009 |
| Status: | inactive |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
June 1, 2011
Halbleiterbauelemente - Mechanische und klimatische Pruefverfahren - Teil 15: Bestaendigkeit gegen Loettemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2010); Deutsche Fassung EN 60749-15:2010 + AC:2011
In diesem Teil der IEC 60749 ist ein Prüfverfahren festgelegt, um bei in Gehäusen montierten Halbleiter- Bauelementen zur Durchsteckmontage (THT, en: through hole technology) deren Beständigkeit...
DIN EN 60749-15
June 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
A description is not available for this item.
October 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003); German version EN 60749-15:2003
A description is not available for this item.
May 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/1583/CDV:2001); German version prEN 60749-15:2001
A description is not available for this item.
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