ARMY - QPL-60091-QPD
Adhesive for Bonding Demolition Charges to Structural Surfaces
| Organization: | ARMY |
| Publication Date: | 26 August 2014 |
| Status: | active |
| Page Count: | 1 |
scope:
This list has been prepared for use by the Government in the procurement of products covered by the subject specification and each listing of a product is not intended to and does connote endorsement of the product by the Department of Defense. All products listed herein have been qualified under the requirements for the product specified in the latest effective issue of the applicable specification. This list is subject to change without notice; revision or amendment of this will be issued as necessary. The listing of a product does not release the supplier from compliance with the specification requirements.
The Activity responsible for this Qualified Products List is the U. S. Army Armament Research, Development and Engineering Center, ATTN: SMCAR-BAC-S, Picatinny Arsenal, New Jersey 07806-5000.
Document History