DIN EN 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
active, Most Current
Buy Now
| Organization: | DIN |
| Publication Date: | 1 October 2009 |
| Status: | active |
| Page Count: | 39 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 60749-20-1
October 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
A description is not available for this item.
Related Products
Searching for related products...