scope:

This drawing forms a part of a one part - one part number documentation system (see herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and Lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 80387-16 Numeric processor extension, 80-bit 02 80387-20 Numeric processor extension, 80-bit 03 80387-25 Numeric processor extension, 80-bit

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X P-AC (68-pin, 1.180" × 1.180" × .345"), pin grid array package Y See figure 1 (68-terminal, .970" × .970" × .115"), ceramic quad flat package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage on any pin (referenced to GND) - - - - - - - - −0.5 V dc to V_CC +0.5 V Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - 2.1 W Thermal resistance, junction-to-case (Θ_JC): Cases X and Y - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - - - +200°C Lead temperature (soldering, 10 seconds) - - - - - - - +260°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc Case operating temperature range (T_C) - - - - - - −55°C to +125°C Minimum high level input voltage (V_IH): Logic inputs - - - - - - - - - - - - - - - - - - 2.0 V dc Clock input - - - - - - - - - - - - - - - - - - 3.7 V dc Maximum low level input voltage (V_IL)- - - - - - - 0.8 V dc Frequency of operation: Device type 01 - - - - - - - - - - - - - - - - 16 MHz Device type 02 - - - - - - - - - - - - - - - - 20 MHz Device type 03 - - - - - - - - - - - - - - - - 25 MHz

intended Use: