DIN EN 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
inactive
| Organization: | DIN |
| Publication Date: | 1 October 2009 |
| Status: | inactive |
| Page Count: | 39 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
January 1, 2012
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
In diesem Teil der IEC 60749 ist ein Standard-Prüfverfahren zur Bestimmung der Lötbarkeit von Bauelementegehäuse- Anschlüssen, welche dazu bestimmt sind, bei der Bauelementemontage mit anderen...
DIN EN 60749-21
October 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
A description is not available for this item.
June 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2004); German version EN 60749-21:2005
A description is not available for this item.
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