DIN EN 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 October 2009 |
| Status: | inactive |
| Page Count: | 39 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 60749-21
October 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
A description is not available for this item.
Related Products
Searching for related products...