DIN IEC 62137-3
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints (IEC 91/876/CD:2009)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 October 2009 |
| Status: | inactive |
| Page Count: | 81 |
| ICS Code (Electronic components in general): | 31.020 |
Document History
DIN IEC 62137-3
October 1, 2009
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints (IEC 91/876/CD:2009)
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