DIN IEC 61189-11
Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 2009 |
| Status: | inactive |
| Page Count: | 17 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 61189-11
November 1, 2009
Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
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