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DOD - DSCC-DWG-88013

DELAY LINES, PASSIVE, 3-PIN, SIP

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Organization: DOD
Publication Date: 22 December 2009
Status: active
Page Count: 9
scope:

This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines.

Document History

DSCC-DWG-88013
December 22, 2009
DELAY LINES, PASSIVE, 3-PIN, SIP
This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines.
DSCC-DWG-88013 REV F
July 1, 2005
DELAY LINES, PASSIVE, 3-PIN, SIP
This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines.
DSCC-DWG-88013
October 1, 1999
DELAY LINES, PASSIVE, 3-PIN, SIP
This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines.
DESC-DWG-88013 REV D
December 17, 1992
DELAY LINES, PASSIVE, 3-PIN, SIP
This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines. The complete PIN shall be as shown in the following example:
DESC-DWG-88013 REV C
October 7, 1991
DELAY LINES, PASSIVE, 3-PIN, SIP
A description is not available for this item.
DESC-DWG-88013 REV B
September 27, 1990
DELAY LINES, PASSIVE, 3-PIN, SIP
A description is not available for this item.
DESC-DWG-88013 REV A
August 30, 1988
DELAY LINES, PASSIVE, 3-PIN, SIP
A description is not available for this item.
DESC-DWG-88013
December 16, 1987
DELAY LINES, PASSIVE, 3-PIN, SIP
A description is not available for this item.
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References

This document references:
MIL-DTL-19491 - SEMICONDUCTOR DEVICES, PACKAGING OF
Published by NPFC on March 17, 2021
Scope. This specification covers the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes (FSC 5961) (see 6.1).
This document references:
MIL-HDBK-454 - GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT
Published by NPFC on December 12, 2012
A description is not available for this item.
This document references:
MIL-PRF-55681 - CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Published by NPFC on September 8, 2017
This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors...
This document references:
MIL-PRF-83531 - DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR
Published by NPFC on January 7, 2020
Scope. This specification covers the general requirements for fixed passive (tapped and untapped) pulse delay lines. The specification has two product levels, a high reliability screening level “M”...
This document references:
MIL-STD-1285 - MARKING OF ELECTRICAL AND ELECTRONIC PARTS
Published by NPFC on July 8, 2019
Scope. This standard establishes requirements for the physical marking of electrical and electronic parts. This standard should be implemented by incorporating suitable requirements directly in...
This document references:
MIL-STD-202 - TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS
Published by NPFC on February 6, 1956
A description is not available for this item.
This document references:
MIL-STD-31000 - TECHNICAL DATA PACKAGES
Published by NPFC on October 31, 2018
This standard defines the requirements for a technical data package (TDP) and its related TDP data management products. The purpose of the TDP is to provide an authoritative technical description of...
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