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IPC - J-STD-020 CHINESE

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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Organization: IPC
Publication Date: 1 March 2008
Status: active
Page Count: 24

Document History

J-STD-020 CHINESE
March 1, 2008
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
A description is not available for this item.

References

This document references:
JEDEC JESD 22-A120 - Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices
Published by JEDEC on July 1, 2014
The purpose of this test method is to provide a means for determining the moisture sorption properties of organic materials used in the packaging of electronic devices. This specification details the...
This document references:
JESD22-B101D - External Visual
Published by JEDEC on April 1, 2022
External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished packaged device. External visual is a noninvasive and nondestructive test....
This document references:
JEDEC JESD 22-B112 - Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
Published by JEDEC on August 1, 2018
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount...
This document references:
TM-650 2.1.1.2A - Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
Published by IPC on May 1, 2004
This procedure is an alternate method for preparing multiple metallographic specimen(s) using microsection equipment. The specimen(s) is(are) for evaluation for quality of the laminate system,...
This document references:
IPC-TM-650 2.1.1 - Microsectioning, Manual and Semi or Automatic Method
Published by IPC on June 1, 2015
This method is to be used as a guideline for preparing a metallographic specimen of printed boards. The finished microsection is used for evaluating the quality of the laminate system and plated...
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