JSA - JIS C 60068-2-69
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
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| Organization: | JSA |
| Publication Date: | 21 December 2009 |
| Status: | inactive |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
Document History
March 22, 2021
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Amendment 1)
A description is not available for this item.
March 20, 2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
JIS C 60068-2-69
December 21, 2009
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
A description is not available for this item.