scope:

Abstract:

There is an extensive history of resistance thermal device (RTD) failures on NASA and DOD missions due to thermally-induced mechanical stress. Recent MER ground and in-flight failures, including some failures in mission critical MER applications, suggest that these devices remain sensitive to variations in the mounting configuration. Perform Package Qualification Verification (PQV) for all critical RTD applications. For non-critical applications, develop standard, flight qualified installations and methods, and track the part pedigree.