NASA-LLIS-0429
Lessons Learned – Low Strength Solder Joints (~1975)
active, Most Current
| Organization: | NASA |
| Publication Date: | 15 July 1996 |
| Status: | active |
| Page Count: | 2 |
scope:
Abstract:
In the process of reflow soldering flat pack leads to printed circuit boards during the Voyager program, it was discovered that a high phosphorous content in the plating process for the Kovar leads can weaken solder joints. Evaluate the effects of phosphorus when soldering or welding nickel plated surfaces.
Document History
NASA-LLIS-0429
July 15, 1996
Lessons Learned – Low Strength Solder Joints (~1975)
Abstract:
In the process of reflow soldering flat pack leads to printed circuit boards during the Voyager program, it was discovered that a high phosphorous content in the plating process for the...
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