NASA-LLIS-0275
Lessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cycling
active, Most Current
| Organization: | NASA |
| Publication Date: | 9 July 1993 |
| Status: | active |
| Page Count: | 3 |
scope:
Abstract:
Over the years, numerous incidents of failed solder joints have occurred to electronic equipment at JPL and contractor facilities. The problem was traced to thermal cycling of conformal coatings.
The lesson recommendations pertain to prediction of the thermal cycling environment, application of conformal coatings, packaging design reviews, and packaging design and fabrication processes, procedures, and documentation.
Document History
NASA-LLIS-0275
July 9, 1993
Lessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cycling
Abstract:
Over the years, numerous incidents of failed solder joints have occurred to electronic equipment at JPL and contractor facilities. The problem was traced to thermal cycling of conformal...
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