NASA-LLIS-0794
Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level
active, Most Current
| Organization: | NASA |
| Publication Date: | 17 April 2000 |
| Status: | active |
| Page Count: | 4 |
scope:
Practice:
Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects (solder joints, bondlines, wirebonds, etc.).
Document History
NASA-LLIS-0794
April 17, 2000
Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level
Practice:
Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects...