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DLA - SMD-5962-88575

MICROCIRCUITS, DIGITAL, FAST CMOS, 10-BIT NONINVERTING BUS INTERFACE LATCH WITH THREE-STATE OUTPUT, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 27 September 1989
Status: inactive
Page Count: 14
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54FCT841A 10-bit noninverting bus interface latch with three-state output, TTL compatible 02 54FCT841B 10-bit noninverting bus interface latch, with three-state output, TTL compatible

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24 lead, .640" × .420" × .090"), flat package L D-9 (24 lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Output voltage range - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) - - - - - - - - - - - −20 mA DC output diode current (IOK)- - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) 2/ - - - - - - - - 500 mW Thermal resistance, junction to case (θJC) - - - - See MIL-M-38510, appendix C Storage temperature range- - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ)- - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - +300°C

Supply voltage (VCC) - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low level input voltage (VIL) - - - 0.8 V dc Minimum high level input voltage (VIH) - - - 2.0 V dc Case operating temperature range (TC) - - - −55°C to +125°C

Minimum setup time, Dn to LE, (ts): Device type 01 - - - - - - - - - - - - - - - - - 2.5 ns Device type 02 - - - - - - - - - - - - - - - - - 2.5 ns Minimum hold time, Dn to LE, (th): Device type 01 - - - - - - - - - - - - - - - - - 3.0 ns Device type 02 - - - - - - - - - - - - - - - - - 2.5 ns Minimum pulse width, LE, (tw): Device type 01 - - - - - - - - - - - - - - - - - 6.0 ns Device type 02 - - - - - - - - - - - - - - - - - 4.0 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

August 28, 2023
MICROCIRCUIT, DIGITAL, FAST CMOS, 10-BIT NONINVERTING BUS INTERFACE LATCH WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
February 2, 2010
MICROCIRCUIT, DIGITAL, FAST CMOS, 10-BIT NONINVERTING BUS INTERFACE LATCH WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-88575
September 27, 1989
MICROCIRCUITS, DIGITAL, FAST CMOS, 10-BIT NONINVERTING BUS INTERFACE LATCH WITH THREE-STATE OUTPUT, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

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