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IPC - TM-650 2.4.9.2

Bonding Process

active, Most Current
Organization: IPC
Publication Date: 1 November 1998
Status: active
Page Count: 2
scope:

In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the recommended procedure for both pretacking and bonding anisotropically conductive films (ACF). This method describes a fully manual procedure.

Document History

TM-650 2.4.9.2
November 1, 1998
Bonding Process
In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the...

References

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