IPC - TM-650 2.4.9.2
Bonding Process
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 November 1998 |
| Status: | active |
| Page Count: | 2 |
scope:
In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the recommended procedure for both pretacking and bonding anisotropically conductive films (ACF). This method describes a fully manual procedure.
Document History
TM-650 2.4.9.2
November 1, 1998
Bonding Process
In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the...