UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ASHRAE - OR-10-004

System Architectures and Fluids for High Heat Density Cooling Solutions

active, Most Current
Organization: ASHRAE
Publication Date: 1 January 2010
Status: active
Page Count: 8
scope:

INTRODUCTION

According to ASHRAE's publication "Datacom Equipment Power Trends and Cooling Applications", by 2010, computer and communications rack heat loads are projected to reach 15 to 48 kW heat load per rack.

Driving this trend is the fact that advances in technology are allowing more and more computing power to be placed into smaller and smaller packages. Other contributing factors include the trend of businesses to reduce capital costs by putting virtualized servers in smaller spaces, and consolidation of multiple remote data centers into centralized mega data centers. This compaction increases power requirements thereby generating more heat.

Document History

OR-10-004
January 1, 2010
System Architectures and Fluids for High Heat Density Cooling Solutions
INTRODUCTION According to ASHRAE's publication "Datacom Equipment Power Trends and Cooling Applications", by 2010, computer and communications rack heat loads are projected to reach 15 to 48 kW heat...
Advertisement