DSF/FprEN 60749-40
Semiconductor devices - Mechanical and climatic test methods -- Part 40: Board level drop test method using a strain gauge
pending
| Organization: | DS |
| Status: | pending |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
October 14, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment,...
Semiconductor devices - Mechanical and climatic test methods -- Part 40: Board level drop test method using a strain gauge
This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment,...
DSF/FprEN 60749-40
Semiconductor devices - Mechanical and climatic test methods -- Part 40: Board level drop test method using a strain gauge
A description is not available for this item.