DIN IEC 62047-13
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 May 2010 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN IEC 62047-13
May 1, 2010
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
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