IEC 60749-19
AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength
inactive
Buy Now
| Organization: | IEC |
| Publication Date: | 1 July 2010 |
| Status: | inactive |
| Page Count: | 8 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
November 1, 2010
Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength
This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method,...
IEC 60749-19
July 1, 2010
AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength
A description is not available for this item.
February 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength
A description is not available for this item.