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IEC/TR 62258-3

Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage

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Organization: IEC
Publication Date: 1 August 2010
Status: active
Page Count: 114
ICS Code (Other semiconductor devices): 31.080.99
scope:

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including:

- wafers,

- singulated bare die,

- die and wafers with attached connection structures, and

- minimally or partially encapsulated die and wafers.

This report contains suggested good practice for the handling, packing and storage of die products.

Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

Document History

IEC/TR 62258-3
August 1, 2010
Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached...
June 1, 2005
Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage
A description is not available for this item.

References

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