DIN EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
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| Organization: | DIN |
| Publication Date: | 1 October 2010 |
| Status: | active |
| Page Count: | 15 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-19
October 1, 2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
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