IEC 62374-1
Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
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| Organization: | IEC |
| Publication Date: | 1 September 2010 |
| Status: | active |
| Page Count: | 36 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Document History
IEC 62374-1
September 1, 2010
Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor...