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BSI - BS EN 62258-1

Semiconductor die products Part 1: Procurement and use

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Organization: BSI
Publication Date: 30 November 2010
Status: active
Page Count: 48
ICS Code (Other semiconductor devices): 31.080.99

Document History

BS EN 62258-1
November 30, 2010
Semiconductor die products Part 1: Procurement and use
A description is not available for this item.
BS EN 62258-1
March 7, 2006
Semiconductor die products Part 1: Requirements for procurement and use
A description is not available for this item.

References

This document references:
IEC 61340-5-1 - Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
Published by IEC on May 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
BS PD IEC/TR 62258-8 - Semiconductor die products - Part 8: EXPRESS model schema for data exchange
Published by BSI on September 30, 2008
A description is not available for this item.
This document references:
IPC/EIA J-STD-028 - Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Published by IPC on August 1, 1999
This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet...
This document references:
IEC 60749-27 - Semiconductor devices – Mechanical and climatic test methods – Part 27: Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)
Published by IEC on September 1, 2012
This part of IEC 60749 establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a defined machine...
This document references:
ISO 8879 - Information Processing - Text and Office Systems - Standard Generalized Markup Language (SGML)
Published by ISO on October 15, 1986
This International Standard: a) Specifies an abstract syntax known as the Standard Generalized Markup Language (SGML). The language expresses the description of a document's structure and other...
This document is referenced by:
BS EN 62258-6 - Semiconductor die products Part 6: Requirements for information concerning thermal simulation
Published by BSI on November 30, 2006
A description is not available for this item.
This document is referenced by:
BS EN 62258-5 - Semiconductor die products Part 5: Requirements for information concerning electrical simulation
Published by BSI on November 30, 2006
A description is not available for this item.
This document is referenced by:
BS EN 62258-2 - Semiconductor die products Part 2: Exchange data formats
Published by BSI on July 31, 2011
A description is not available for this item.
This document is referenced by:
BS EN IEC 62402 - Obsolescence management
Published by BSI on July 31, 2019
A description is not available for this item.
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