JEDEC JESD 51-14
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
|Publication Date:||1 November 2010|
This document specifies a test method (referred to herein as "Transient Dual Interface Measurement") to determine the conductive thermal resistance "Junction-to-Case" RθJC (θJC) of semiconductor devices with a heat flow through a single path, i.e. semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink.
The thermal resistance measured using this document is RθJCx or θJCx, where x denotes the package case side, where the heat is extracted, usually top (x= top) or bottom (x= bot) side.