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IPC-6012 CHINESE

Qualification and Performance Specification for Rigid Printed Boards

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Organization: IPC
Publication Date: 1 April 2010
Status: inactive
Page Count: 68
scope:

本规范建立并规定了刚性印制板生产的鉴定及性能要求。

Document History

IPC-6012 CHINESE
April 1, 2020
Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
A description is not available for this item.
IPC-6012 CHINESE
March 1, 2020
Qualification and Performance Specification for Rigid Printed Boards
A description is not available for this item.
IPC-6012 CHINESE
April 1, 2016
刚性印制板的鉴定及性能规范 汽车要求附件
A description is not available for this item.
IPC-6012 CHINESE
September 1, 2015
刚性印制板的鉴定及性能规范
A description is not available for this item.
IPC-6012 CHINESE
April 1, 2010
Qualification and Performance Specification for Rigid Printed Boards
本规范建立并规定了刚性印制板生产的鉴定及性能要求。

References

This document references:
ASME B46.1 - Surface Texture (Surface Roughness, Waviness, and Lay)
Published by ASME on January 1, 2019
This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying...
This document references:
ASTM B579 - Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
Published by ASTM on March 29, 1973
This specification covers the requirements for electrodeposited tin-lead coatings on fabricated articles of iron, steel, copper, and copper alloys, to protect them against corrosion (Note 1), to...
This document references:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
This document references:
IPC-JP002 - Current Tin Whiskers Theory and Mitigation Practices Guideline
Published by IPC on March 1, 2006
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or...
This document references:
IPC-TM-650 2.6.3.7 - Surface Insulation Resistance
Published by IPC on March 1, 2007
This test method is used to quantify the deleterious effects of fabrication, process or handling residues on Surface Insulation Resistance (SIR) in the presence of moisture. The electrodes are long...
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