Standard Test Method for Porosity in Metallic Coatings by Humid Sulfur Vapor (“Flowers-of-Sulfur”)
|Publication Date:||10 October 1995|
|ICS Code (Metallic coatings):||25.220.40|
This standard covers equipment and test methods for determining the porosity of metallic coatings, where the pores penetrate down to a silver, copper, or copper-alloy substrate.
This test method is suitable for coatings consisting of single or combined layers of any coating that does not significantly tarnish in a reduced sulfur atmosphere, such as gold, nickel, tin, tin-lead, and palladium, or their alloys.
This test method is designed to determine whether the porosity level is less than or greater than some value which by experience is considered by the user to be acceptable for the intended application.
Recent reviews of porosity testing and testing methods can be found in the literature.2,3 Guide B765 is suitable to assist in the selection of porosity tests for electrodeposits and related metallic coatings. Other porosity test standards are Test Methods B735, B741, B798, and B799.
The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. For specific hazards statements, see Section 8.
This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2 Clarke, M., "Porosity and Porosity Tests," Properties of Electrodeposits, Sard, Leidheiser, and Ogburn, eds., The Electrochemical Society, 1975, p. 122.
3 Krumbein, S. J., "Porosity Testing of Contact Platings," Transactions of the Connectors and Interconnection Technology Symposium, Philadelphia, PA, October 1987, p. 47.