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IPC PERM-WP-022

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report

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Organization: IPC
Publication Date: 1 August 2018
Status: active
Page Count: 28
scope:

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC/ PERM Task group 8-81, during which identical sets of test vehicles were assembled, in accordance with IPC J-STD-001, Class 3, at multiple locations. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.

Document History

IPC PERM-WP-022
August 1, 2018
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full...
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