Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin – Final Report
|Publication Date:||1 August 2018|
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC/ PERM Task group 8-81, during which identical sets of test vehicles were assembled, in accordance with IPC J-STD-001, Class 3, at multiple locations. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.