IEC 61191-1 REDLINE
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
|Publication Date:||1 September 2018|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.