CENELEC - EN IEC 61189-2-630
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 October 2018 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This document specifies a test method to determine the amount of water absorbed by metalclad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
Document History
EN IEC 61189-2-630
October 1, 2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
This document specifies a test method to determine the amount of water absorbed by metalclad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.