DIN EN 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 2018 |
| Status: | inactive |
| Page Count: | 72 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN 61189-5-601
November 1, 2018
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
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