DIN EN IEC 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
pending, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 2018 |
| Status: | pending |
| Page Count: | 79 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN IEC 60749-20-1
November 1, 2018
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
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