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NPFC - MIL-PRF-39016/55

RELAY, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION

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Organization: NPFC
Publication Date: 2 November 2018
Status: active
Page Count: 9

Document History

MIL-PRF-39016/55
November 2, 2018
RELAY, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
A description is not available for this item.
MIL-PRF-39016/55
December 19, 2011
Relay, Electromagnetic, Established Reliability, DPDT, Low Level to 2 Amperes (.200-Inch Terminal Spacing), with Internal Diode for Coil Transient Suppression
A description is not available for this item.
MIL-PRF-39016/55B
October 31, 2006
RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
A description is not available for this item.
MIL-PRF-39016/55
February 15, 2002
RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
A description is not available for this item.
MIL-PRF-39016/55
February 15, 1991
RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification...
MIL-R-39016/55
September 13, 1990
RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
A description is not available for this item.
MIL-R-39016/55
July 10, 1990
RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (.200-INCH TERMINAL SPACING), WITH INTERNAL DIODE FOR COIL TRANSIENT SUPPRESSION
A description is not available for this item.
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References

This document references:
ASTM B488 - Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses
Published by ASTM on August 1, 2018
This specification covers requirements for electrodeposited gold coatings that contain not less than 99.00 mass % gold and that are used for engineering applications. Specifically excluded from this...
This document references:
MIL-PRF-39016/6 - RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, DPDT, LOW LEVEL TO 2 AMPERES (0.200-INCH TERMINAL SPACING)
Published by NPFC on April 1, 2005
A description is not available for this item.
This document references:
MIL-PRF-39016 - RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Published by NPFC on September 13, 2017
A description is not available for this item.
This document references:
MIL-STD-1285 - MARKING OF ELECTRICAL AND ELECTRONIC PARTS
Published by NPFC on July 8, 2019
Scope. This standard establishes requirements for the physical marking of electrical and electronic parts. This standard should be implemented by incorporating suitable requirements directly in...
This document references:
MIL-STD-202-204 - Method 204, Vibration, High Frequency
Published by NPFC on January 17, 2020
A description is not available for this item.
This document references:
MIL-STD-202-213 - Method 213, Shock (Specified Pulse)
Published by NPFC on January 22, 2020
A description is not available for this item.
This document references:
MIL-STD-202-214 - TEST METHOD STANDARD METHOD 214, RANDOM VIBRATION
Published by NPFC on April 18, 2015
Purpose. This test is conducted for the purpose of determining the ability of component parts to withstand the dynamic stress exerted by random vibration applied between upper and lower frequency...
This document references:
MIL-STD-750 - TEST METHODS FOR SEMICONDUCTOR DEVICES
Published by NPFC on November 30, 2016
Purpose. This standard establishes uniform methods and procedures for testing semiconductor devices suitable for use within Military and Aerospace electronic systems. The methods and procedures in...
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