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GMW16552

Semiconductor Change Process Specification

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Organization: GMW
Publication Date: 1 March 2011
Status: inactive
Page Count: 12
scope:

This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose changes directly to GM, or to GM and GM's Integration Supplier when there is an Integration Supplier, due to Unexpected Part Shortages, part "end of life", part modifications, etc. This process does not apply to changes, made due to a change request from GM, that affect functions or features, changes to correct non-compliances, etc. The Electrical Component/Subsystem Supplier is defined as a supplier who receives electrical requirements from GM.

The Supplier Hardware Change Management Process for Semiconductor Part Changes is to be used as a method for communicating the technical viability of a change proposal for any electrical component/subsystem. Any approval authority stated herein shall apply only to the technical element of the proposed change. This process does not replace the Engineering Work Order (EWO) or any other GM cost and investment process where the supplier receives authorization to change piece price, investment, etc. Also, this process does not replace any Production Part Approval Process (PPAP) or supplier quality requirements and processes.

Document History

January 1, 2018
Semiconductor Change Process Specification
Introduction Note: Nothing in this standard supercedes applicable laws and regulations. Note: In the event of conflict between the English and domestic language, the English language shall take...
GMW16552
March 1, 2011
Semiconductor Change Process Specification
This standard defines the GM Supplier Hardware Change Management Process for Semiconductor Part Changes. This process is the means by which the Electrical Component/Subsystem Supplier shall propose...

References

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