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IPC/JEDEC J-STD-033 CH

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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Organization: IPC
Publication Date: 1 April 2018
Status: active
Page Count: 32

Document History

IPC/JEDEC J-STD-033 CH
April 1, 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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