DIN IEC 47D/113/CD
Semiconductor devices, mechanical standardization - Proposal for a plastic thin small package P-TSOP II, 7,62 mm body family (if approved to be included in IEC 60191-2) (IEC 47D/113/CD:1996)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 1996 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/113/CD
August 1, 1996
Semiconductor devices, mechanical standardization - Proposal for a plastic thin small package P-TSOP II, 7,62 mm body family (if approved to be included in IEC 60191-2) (IEC 47D/113/CD:1996)
A description is not available for this item.
Related Products
Searching for related products...