DIN IEC 60249-3-1
Base materials for printed circuits; special materials; specification no. 1: prepreg for use as bonding sheet material in the fabrication of multilayer printed boards; identical with IEC 60249-3-1, edition 1981
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 October 1986 |
| Status: | inactive |
| Page Count: | 8 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 60249-3-1
October 1, 1986
Base materials for printed circuits; special materials; specification no. 1: prepreg for use as bonding sheet material in the fabrication of multilayer printed boards; identical with IEC 60249-3-1, edition 1981
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