DIN IEC 91/141/CD
IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly (IEC 91/141/CD:1998)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 1998 |
| Status: | inactive |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
DIN IEC 91/141/CD
November 1, 1998
IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly (IEC 91/141/CD:1998)
A description is not available for this item.
References
Related Products
Searching for related products...