scope:

This document applies to ESD withstand level information in datasheets or other information publications such as reliability or qualification reports. All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) should have this information provided.

NOTE: This document does not apply to electrically-initiated explosive devices, flammable liquids, or powders

PURPOSE

This document is intended to guide device manufacturers in developing datasheets and to device customers in understanding datasheet entries. Standardized ESD stress test methods have been developed to evaluate the relative sensitivity of devices. Although these methods are available, the results of the testing are not always provided by the suppliers, especially charged device model (CDM) levels. The document provides a standardized template which includes a minimum information set and gives guidelines for expanded individual pin information when needed. The document should improve the availability and usefulness of reported ESD data