AENOR - UNE-EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 June 2012 |
| Status: | active |
| Page Count: | 29 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
UNE-EN 62047-9
June 1, 2012
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
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