AENOR - UNE-EN 60191-6-3
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 December 2001 |
| Status: | active |
| Page Count: | 21 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
UNE-EN 60191-6-3
December 1, 2001
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
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