AENOR - UNE-EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 July 2014 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
UNE-EN 61190-1-2
July 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
A description is not available for this item.
December 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.