AENOR - UNE-EN 60191-6-19
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 September 2010 |
| Status: | active |
| Page Count: | 17 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
UNE-EN 60191-6-19
September 1, 2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
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