AENOR - UNE-EN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 April 2018 |
| Status: | active |
| Page Count: | 52 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
UNE-EN IEC 61190-1-3
April 1, 2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
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