AENOR - UNE-EN 60191-6-4
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 October 2003 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
UNE-EN 60191-6-4
October 1, 2003
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
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