UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

CEI EN 61189-5-1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

active, Most Current
Buy Now
Organization: CEI
Publication Date: 1 March 2017
Status: active
Page Count: 36
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

Document History

CEI EN 61189-5-1
March 1, 2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of...

References

Advertisement