IEC TR 62878-2-7
Device embedding assembly technology Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit boards
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| Organization: | IEC |
| Publication Date: | 1 March 2019 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
Document History
IEC TR 62878-2-7
March 1, 2019
Device embedding assembly technology Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit boards
This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection...