DIN EN IEC 61189-2-801
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
pending, Most Current
| Organization: | DIN |
| Publication Date: | 1 April 2019 |
| Status: | pending |
| Page Count: | 17 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 61189-2-801
April 1, 2019
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
A description is not available for this item.