DIN EN 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
inactive
| Organization: | DIN |
| Publication Date: | 1 October 2007 |
| Status: | inactive |
| Page Count: | 45 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
April 1, 2010
Halbleiterbauelemente - Mechanische und klimatische Pruefverfahren - Teil 20: Bestaendigkeit kunststoffverkappter oberflaechenmontierbarer Bauelemente (SMD) gegenueber der kombinierten Beanspruchung von Feuchte und Loetwaerme (IEC 60749-20:2008); Deutsche Fassung EN 60749-20:2009
A description is not available for this item.
DIN EN 60749-20
October 1, 2007
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
A description is not available for this item.
December 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002 + Corr. 1:2003); German version EN 60749-20:2003
A description is not available for this item.
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